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Thesis
Home   /   Thesis   /   Integrated material–process–device co-optimization for the design of high-performance RF transistors on advanced nanometer technologies

Integrated material–process–device co-optimization for the design of high-performance RF transistors on advanced nanometer technologies

Electronics and microelectronics - Optoelectronics Emerging materials and processes for nanotechnologies and microelectronics Engineering sciences Technological challenges

Abstract

This PhD research focuses on the integrated co-optimization of materials, fabrication processes and device architectures to enable high-performance RF transistors on advanced nanometer-scale technologies. The work aims to understand and improve key RF figures of merit—such as transit frequency, maximum oscillation frequency, noise behaviour and linearity—by establishing clear links between material choices, process innovations and transistor design.

The project combines experimental development, structural and electrical characterization, and advanced TCAD simulations to analyse the strengths and limitations of different integration schemes, including FD-SOI and emerging 3D architectures such as GAA and CFET. Particular attention will be given to the engineering of optimized spacers, gate stacks, junction placement and epitaxial source/drain materials in order to minimize parasitic effects and enhance RF efficiency.

By comparing planar and 3D device platforms within a unified modelling and characterization framework, the thesis aims to provide technology guidelines for future generations of energy-efficient RF transistors targeting applications in 5G/6G communications, automotive radar and low-power IoT systems.

Laboratory

Département Composants Silicium (LETI)
Service des Composants pour le Calcul et la Connectivité
Laboratoire des Transistors Avancés
Université Grenoble Alpes
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