Reliability of RF GaN transistors for 5G millimeter Wave applications
Gallium Nitride components are very good candidates for power amplification at Millimeter Wave frequencies such as 5G (~30GHz), due to their power density and energy efficiency. However, these technologies are commonly integrated on Silicon Carbide substrates, which are thermally efficient but expensive and have small diameters. CEA-LETI's GaN/Si technology provides world-class performance in Ka band, with power densities competing with GaN/SiC technologies. These devices, fabricated on 200mm Si substrates, are compatible with Silicon clean rooms and promise greater available volumes and lower costs. Furthermore, the Silicon-like back-end levels offer possibilities for dense heterogeneous integration with digital circuits, paving the way towards heterogeneous RF Integrated Circuits (RFICs).
However, few studies exist nowadays on the degradation mechanisms tied to these specific components with CMOS-compatible process: advanced barriers, in-situ MIS gates, ohmic contacts, etc... It is mandatory to know and master these effects to qualify the technology as well as better understand the device weaknesses and limitations.
The goal of this PhD is to evaluate the parasitic memory effects as well as the transistor aging under operational conditions using DC and RF measurements, linked to the device physics. The transistors will be subjected to various electrical stress conditions to model their DC & RF degradation: trapping effects measurements (BTI, DCTS), influence of the process and gate technology (Schottky vs MIS), the electrical confinement inside the structure (GaN:C, AlGaN back-barrier, etc…). Time Dependent Dielectric Breakdown (TDDB) measurements will be made on MIS gates from DC to RF domain, to study the time to breakdown increase with input signal frequency, in a similar manner than gate dielectrics in CMOS devices. Finally, electrical stresses in DC and RF conditions (RF CW stresses) will be performed to evaluate and model the transistor degradation under operational conditions.
Vertical GaN power devices development using localized epitaxy
This PhD offers a unique opportunity to enhance your skills in GaN power devices and develop cutting-edge architectures. You’ll work alongside a multidisciplinary team specializing in materials engineering, characterization, device simulation, and electrical measurements. If you’re eager to innovate, expand your knowledge, and tackle state-of-the-art challenges, this position is a valuable asset to your career!
Vertical GaN power components hold great promise for power applications beyond the kV range. Localized epitaxy of GaN enables the creation of thick structures on Si substrates at a competitive cost, with demonstrated success for diodes and pseudo-vertical transistors. However, this approach’s significant surface area limits the energy density of the devices. This PhD aims to develop denser, fully vertical components using layer transfer methods. You’ll study their electrical characteristics to monitor the impact of technological variations on their performance.
Throughout this PhD, you’ll gain comprehensive knowledge in microelectronics processes, electrical characterization, and TCAD (Technology Computer-Aided Design) simulation. You’ll collaborate with a multidisciplinary team including our partner CNRS-LTM and deepen your understanding of GaN power devices, all while being part of a lab dedicated to the development of wide-bandgap power devices. You will have the opportunity to write publications and patents.
Simulation and characterization of integrated structures during and after the millisecond laser annealing step
Laser annealing processes are now used in a large range of applications in most advanced microelectronics technologies. Whether in the context of advanced planar CMOS components or 3D integration technologies, the specific characteristics of laser annealing enables to reach very high temperatures in very short times, at die scale, and to work in conditions out of thermodynamic equilibrium. This has many advantages in terms of physical effects (activation of high dopants with low diffusions, transformation of silicides, etc.), but also thermal budget (high temperatures which remain on the surface of the material). However, this kind of ultrashort optical annealing can generate pattern effect temperature variations on the chip surface between two zones with different radiative andor thermal properties. These temperature differences may alter the electrical performances of the devices and thus have to be evaluated and overcome. A part of this work will consist, by the help of bibliography study, in finding integrative solutions (design, absorbent layer,…), in order to encounter this issue. Besides, at LETI, a wide knowledge of Nanosecond Laser Annealing (NLA) is in place for many years, and process teams are in the acquisition phase of a millisecond laser equipment (DSA). This work will represent, thanks to the numerical simulation, one of the essential building blocks for the development of the millisecond laser annealing at LETI which is mandatory for advanced technologies roadmap.
This interdisciplinary research will encompass fields such as numerical simulations, materials science, microelectronic manufacturing processes. You will benefit from the support of laboratories specializing in integration processes, as well as TCAD simulation environments.
Selective epitaxial Regrowth for extended Base contact in High-Performance Antimonide-based HBT Transistors
With the rapid expansion of wireless networks and the imminent arrival of 6G, the need for highly efficient communication systems has never been more critical. In this context, frequencies beyond 140 GHz emerge as a key frontier, where cutting-edge technologies leverage advanced semiconductors like InP, delivering unmatched performance beyond what SiGe solutions can achieve. However, III-V components remain expensive, manufactured on small substrates (100 mm for InP), and incompatible with silicon production lines, which ensure higher industrial yields.
In this context, CEA-LETI, in collaboration with CNRS-LTM, is developing a new HBT transistor technology in which the base layer is made of antimonides, having already demonstrated frequency performance beyond the THz range. To enable integration with Si-CMOS fabrication processes, a novel approach for ohmic contact formation is required. This involves selective epitaxial regrowth of a suitable semiconductor material on the base layer of the HBT-GaAsSb transistor.
The PhD candidate will be responsible for identifying the optimal material that meets the required criteria, based on experiments conducted with the epitaxy team, advanced physical characterizations (ToF-SIMS, HR-TEM, EDX), and band structure modeling of the formed heterojunctions. This research will also be complemented by the fabrication of technological test structures to extract the key electrical parameters necessary for optimizing the DC and RF performance of the HBT transistor.
Towards eco innovative, sustainable and reliable piezoelectric technology
Are you looking for a Phd position at the intersection of eco-innovation and high-tech? This subject is for you!
You will participate in efforts aimed at reducing the environmental footprint of piezoelectric (PZE) technology applied to micro actuators and sensors, while maintaining optimal levels of electrical performance and reliability. Currently PZE technology primarily relies on PZT material (Pb(Zr,Ti)O3) which contains lead, as well as electrodes made from materials such as Pt, Ru, and Au, along with doping elements like La, Mn and Nb to enhance piezoelectric properties and electrical performance. These materials not only come with a significant ecological cost but are also facing proven or imminent shortages. In the context of the necessary frugality associated with the energy transition, this PhD position aims to explore more environmentally friendly and sustainable microsystem technologies. The research will create a comparative analysis assessing the ecological footprint, electromechanical performance, and reliability of existing technologies (with lead) versus those under development (lead free). To achieve these objectives, you will employ Life Cycle Analyses (LCA), electromechanical measurements, and reliability tests (accelerated aging tests).
This interdisciplinary research will encompass fields such as eco design materials science, and microelectronic manufacturing processes You will benefit from the support of laboratories specializing in microsystems manufacturing and integration processes, as well as electrical characterization and reliability Collaboration with the “eco innovation” unit at CEA Leti will also enhance the resources available for this project.
Increasing the electrothermal robustness of new SiC devices
Silicon Carbide (SiC) is a semiconductor with superior intrinsic properties than Silicon for high temperature and high power electronics applications. SiC devices are expected to be extensively used in the electrification transition and novel energy management applications. To fully exploit the SiC superior properties, the future semiconductor devices will be used under extreme biasing and temperature conditions. These devices must operate safely at higher current densities, higher dV/dt and higher junction temperatures than Si devices does.
The objective of this thesis is to study the SiC devices fabricated at LETI under these extreme operating conditions, and to optimize their design to fully use the theoretical potential of SiC. The thesis work will include several phases that will be strongly coupled:
- Advanced electro-thermal characterisation (50%), by proposing new approaches to testing components in a box or on a suitable support, using artificial intelligence (AI) tools for data extraction and processing. The work will include adapting standard measurement methodologies to the specific switching characteristics of SiC.
- An assessment (15%) of the design and technological parameters responsible for the operating limits of the components.
- A physico-chemical characterisation component (15%) to analyse failures under these extreme conditions.
- The inclusion of predictive models (20%) for the sensitivity of architectures to extreme conditions and faults, based on modelling.
Design and fabrication of neuromorphic circuit based on lithium-iontronics devices
Neural Networks (NNs) are inspired by the brain’s computational and communication processes to efficiently address tasks such as data analytics, real time adaptive signal processing, and biological system modelling. However, hardware limitations are currently the primary obstacle to widespread adoption. To address this, a new type of circuit architecture called "neuromorphic circuit" is emerging. These circuits mimic neuron behaviour by incorporating high parallelism, adaptable connectivity, and in memory computation. Ion gated transistors have been extensively studied for their potential to function as artificial neurons and synapses. Even if these emerging devices exhibit excellent properties due to their ultra low power consumption and analog switching capabilities, they still need to be validated into larger systems.
At the RF and Energy Components Laboratory of CEA-Leti, we are developing new lithium-gated transistors as building blocks for deploying low-power artificial neural networks. After an initial optimization phase focused on materials and design, we are ready to accelerate the pace of development. These devices now need to be integrated into a real system to assess their actual performance and potential. In particular, both bio-inspired circuits and crossbar architectures for accelerated computation will be targeted.
During this 3-year PhD thesis, your (main) objective will be to design, implement, and test neural networks based on lithium-gated transistor crossbars (5x5, 10x10, 20x20) and neuromorphic circuits , along with the CMOS read and write logic to control them. The networks might be implemented using different algorithms and architectures, including Artificial Neural Network, Spiking Neural Networks and Recurrent Neural Networks, which will be then tested by solving spatial and/or temporal pattern recognition problems and reproduce biological functions such as pavlovian conditioning.
In-Sensor Computing for MEMS Sensors: Toward an Electromechanical Neural Network
The rise of machine learning models for processing sensor data has led to the development of Edge-AI, which aims to perform these data processing tasks locally, directly at the sensor level. This approach reduces the amount of data transmitted and eases the load on centralized computing centers, providing a solution to decrease the overall energy consumption of systems. In this context, the concept of in-sensor computing has emerged, integrating data acquisition and processing within the sensor itself. By leveraging the physical properties of sensors and alternative computing paradigms, such as reservoir computing and neuromorphic computing, in-sensor computing eliminates the energy-intensive steps of signal conversion and processing.
Applying this concept to MEMS sensors enables the processing of signals such as acceleration, strain, or acoustic signals, with a significant reduction, or even elimination, of traditional electronic components. This has rekindled interest in mechanical computing devices and their integration into MEMS sensors like microphones and accelerometers. Recent research explores innovative MEMS devices integrating recurrent neural networks or reservoir computing, showing promising potential for energy efficiency. However, these advancements are still limited to proof-of-concept demonstrations for simple classification tasks with a very low number of neurons.
Building on our expertise in MEMS-based computing, this doctoral work aims to push these concepts further by developing a MEMS device that integrates a reprogrammable neural network with learning capabilities. The objective is to design an intelligent sensor that combines detection and preprocessing on a single chip, optimized to operate with extremely low energy consumption, in the femtoJoule range per activation. This thesis will focus on the design, fabrication, and validation of this new device, targeting low-frequency signal processing applications in high-temperature environments, paving the way for a new generation of intelligent and autonomous sensors.