Apprenticeship Learning Platform deployment for industrial applications
This project aims at developing a demonstrator that integrates state-of-the-art technologies and improve it on a use-case representative of the industrial world.
The demonstrator will consist in a robotic / cobotic arm coupled to an acquisition sensor (RGBD type). This device will be positioned in a workspace made of a rack / shelf containing objects / pieces of various shapes and qualities (materials, densities, colors ...) in front of which will be placed a typical conveyor prototype of industrial installations. The type of tasks expected to be carried out by the demonstrator will be "pick and place" type tasks where an object will have to be identified in shelf and then placed on the conveyor.
This type of demonstrator will be closer to the real industrial conditions of use than the "toy" examples used in the academic field.
This demonstrator will focus first on the short-term effectiveness based on state of the art technologies for both hardware and software, for a use case representative of the industrial world.
At first, it will thus be less focused on the evolution of the algorithms used than on the adaptation of the parameters, the injection of knowledge a priori dependent on the context making it possible to reduce the high-dimensional input space, etc.
Nonlinear ultrasonic testing for the assessment of adhesive bonding properties
The CEA-LIST carries out Non Destructive Testing (NDT) projects in partnership with various industrial sectors. A strong collaboration with Airbus Group Innovations (AGI) had led to a common entity through the NDT laboratory for Aeronautics Applications (LC2A).
With the increasing portion of composite materials in the aerospace industry, assessment of the adhesive bonding properties of such composite structures is a key issue. Various aspects could decrease the quality of bonding, such as the surface contamination, non-optimal thermal cycle or external mechanical stresses. However, conventional NDT techniques are often not sensible to such damages in the adhesive bonds.
Non-linear ultrasonic methods such as wave mixing, harmonic generation or non- linear imaging appear as promising techniques to detect kissing bonds and pre-damaging that could occur in adhesive bonds. The objective of this postdoc position is to develop NDT innovative solutions for the assessment of the adhesion quality by means of experimental techniques based on such non-linear methods.
This post-doc position will be carried out in the framework of an international research program on the adhesion bonding. The candidate will work in the NDE laboratory for Aeronautics Applications located in Toulouse. Strong skills in experimental physics, instrumentation, and non-linear ultrasonics would be appreciated.
New packaging for power electronics : application to SiC components
In continuity of ongoing work (PhD thesis) on the 3D assembly of vertical Silicon power components, the purpose of the post-doc proposal is to develop a similar assembly on vertical wide-gap SiC power components. The required work will be to define the components (high frequency / high voltage) with the supplier and to adapt them to the best vertical integration (Cu finishing, topology,...), to adjust the metal leadframe design for the 3D assembly, and to develop the transfer layer technology adapted to this new material. The candidate will also take care of the electrical characterizations of the final stack to validate the interest of this 3D packaging on wide-gap power devices.
Innovative modeling for technology-design-system co-optimization
The post-DOC will support the device modeling part of a research project investigating new methodologies for system and circuit optimization with the aim of achieving a better integration between the knowledge of the detailed characteristics of a specific technology, the circuit-design methodology and the system architecture. The practical goal is to leverage the existing multi-disciplinary know-how for benchmarking of system and technologies to advance the analysis past the usual PPA, PPAY and PPAC approaches that are commonly deployed in such cases.
In more detail, the post-DOC will develop "pre"-spice models for actives and passives which will constitute the basic bricks for the optimization methodology developed in the overall project. Active device modeling will have a starting point in the works of EPFL based on the analytical expression of invariants such has the inversion coefficient.
Ultra Low Power RF Communication Circuit and System Design for Wake-Up Radio
Today, there is a strong demand in developing new autonomous Wake-Up radio systems with tunable performances and independent clocking system. The objectives of the proposed contract it to exploit the capacity of CMOS FD-SOI technologies to develop such devices, improving power consumption and RF performance above the state of the art, thanks to the natural low parasitic and tuning capacity through back biasing of the FD-SOI . A particular attention will be paid to the development of a new power efficient, fast settling, frequency synthesis system.
The chosen candidate will be involved both in RF system and circuit design, with the support of the experienced RF System & Design team.
2D materials for Contacts and Gate stacks for advanced CMOS applications
Transition Metal Dicalchogenides (TMDs) have displayed interesting properties in numerous fields of nanotechnoogy (CMOS, memory, sensors, photonics etc.), and emerge as promising materials thanks to their functional properties and potential for co-integration, facilitated by their intrinsic features (van der Waals materials). However, their applicative impact remains uncertain due to the challenge of developing their processing in a standard nanoelectronics environment while maintaining a good control of their fundamental properties. The candidate will quantify the electrical properties of various 2D materials in test structures derived from a silicon technology baseline (TLM, Cross-Bridge Kelvin Résistors, MOS capacitors), in order to provide guidelines for device prototyping.
Specifically, the primary aim is to assess the interest of these materials as interface layers rather than for transport, for improving:
- The contact resistivity via Fermi-level depinning.
- Control by the Gate over the inversion charge in the channel via a negative differential capacitance effect.
Continuum models calibration strategy based on a 3D discrete approach
In order to develop an identification strategy for continuum constitutive models devoted to quasi-brittle materials, suited for structural analysis, often realized arbitrarily, a model based on the discrete element method has been formulated. The discrete model is used to compensate the lack of experimental data required to calibrate the continuum model. Thanks to intrinsic predispositions with respect to fracture mechanisms, the discrete model can be used easily, and its efficiency has been proved. However, only 2D simulations have been undertaken so far, mostly due to computational costs limitations.
A 2D framework reduces extensively analysis possibilites with such model, in particular for reinforced structures where 3D effects are predominant. The purpose of the present post-doctoral work is to extend to 3D the discrete approach already developped in 2D. The developments will be integrated in the FEA code CAST3M-CEA developped by DEN/DANS/DM2S/SEMT. In the mean time, the discrete model will be optimized using available tools, such as solvers, available in the CAST3M-CEA environment. Depending on the computational costs improvements, even complete structures simulations might be considered.
At the end of this work, the developed numerical tool will allow to extend the identification stragegy to constitutive models including 3D effects, such as steel/concrete interface models (confinement) and concrete model (dilatancy).
Microfluidic cell encapsulation
The Laboratory of Biology and Microfluidic Architecture is looking for a candidate to establish a new class of microfluidic devices for cell encapsulation using robust, industry-compatible materials. The laboratory is located in the Microtechnologies for Biology and Healthcare Division of LETI, focused on the development of micro and nanotechnologies for applications in the fields of medical imaging, security, in-vitro diagnostic, nanomedicine, medical devices and environment monitoring. LETI is a research institution focused on creating value and innovation through technology transfer to its industrial partners. It specializes in nanotechnologies and their applications, from wireless devices and systems, to biology, healthcare and photonics.
Design of a power integrated circuit using GaN on Si, characterization, implementation.
The objective is to propose an innovative solution to supply low voltage electronics (3 to 12VDC) or to charge accumulators, using industrial alternating voltages (230VAC / 400VAC). This type of device should benefit greatly from the contribution of integrated passive technologies and the possibilities offered by the ASICs developed at Leti, in particular GaN ASICs. This research program is part of the Leti’s ’power roadmap’. From the state of the art and concepts envisaged by CEA researchers, the post-doctoral student will have to imagine an original solution, to design it and then to characterize the prototype. The research program involves other academic partners, which allows the post-doctoral student to immerse himself in an upstream research context. An industrial application has been identified. The post-doctoral student will be encouraged to enrich the subject with additional functions in the control (regulation) at very high frequency, the transmission of isolated signals via the converter or any other proposals.
Active medical implants encapsulated using hermetic glass package
Microelectronics extends its range of applications via the micro-systems with high level of integration including sensors, energy scavenger, and communication modules. Medical implants such as pacemakers and defibrillators medical implants, drug dispensers, intra-cranial probes are many possible applications for these modules. The use of glass offers a wide field of investigation. Moreover, recent innovations for the glass material (interconnections, thinning, and functionalization) reinforce its relevance to the medical field: biocompatibility, stability, transparency, and potentially lower cost.
The objective of this work is to design and validate technological steps to integrate high level of microsystems encapsulated in glass material.