Study of Failure Modes and Mechanisms in RF Switches Based on Phase-Change Materials
Switches based on phase change materials (PCM) demonstrate excellent RF performance (FOM <10fs) and can be co-integrated into the BEOL of CMOS processes. However, their reliability is still very little studied today. Failure modes such as heater breakage, segregation, or the appearance of cavities in the material are shown during endurance tests, but the mechanisms of these failures are not discussed. The objective of this thesis will therefore be to study the failure modes and mechanisms for different operating conditions (endurance, hold, power). The analysis will be carried out through electrical and physical characterizations and accelerated aging methods will be implemented.
Design and test of a PLL in FD-SOI 28nm technology
The goal of this PhD thesis is to design a Phase Locked Loop for generic use at 5 GHz. This PLL will also include a study regarding each building bloc sensitivity to radiation and thermal sensitivity regarding space environment. This is the main point of this PhD thesis because integrating a PLL in harsh environment requires an accurate knowledge of the circuit's parameters. The candidate will begin its work by analysing existing works on the FD-SOI technology (structure characteristics and impact on radiation hardening) to serve as a base for its work and design a Phase Locked Loop architecture. He will also study how to characterise each PLL building bloc variations in harsh environment (radiation and temperature).
Superconducting Silicon and detection in the far Infrared Universe
Silicon technologies occupy a central position in today’s digital landscape, both for the fabrication of semiconductor devices and for the development of advanced sensors. In 2006, the discovery of superconductivity in silicon heavily doped with boron opened a new field of research. Since then, several laboratories, including CEA, have been investigating its electronic properties and potential applications. This emerging material exhibits particularly attractive characteristics for systems operating at sub-Kelvin cryogenic temperatures, especially in the fields of quantum electronics and ultra-sensitive detectors used in fundamental physics and astrophysics.
Despite these advances, the understanding of superconducting silicon remains incomplete, particularly regarding its thermal, mechanical, and optical properties at the micrometric scale. The proposed PhD aims to address these gaps by combining modelling, design, technological fabrication, and cryogenic characterization of prototype devices, within a close collaboration between CEA-Léti and CEA-Irfu. The main objective will be to develop a new generation of detectors based on this superconducting material and to demonstrate their relevance for the detection of electromagnetic radiation in the terahertz and far-infrared ranges.
Introduction of innovative materials for sub-10nm contact realization
As part of the FAMES project and the European ChipACT initiative, which aim to ensure France’s and Europe’s sovereignty and competitiveness in the field of electronic nano-components, CEA-LETI has launched the design of new FD-SOI chips. Among the various modules being developed, the fabrication of electrical contacts is one of the most critical modules in the success of advanced node development.
For sub-10 nm node, the contact realization is facing a lot of challenges like punchthrough (due to low etch selectivity during contact etching), voids during metal deposition, self-alignment, and parasitic capacitance. New breakthrough approach has recently been proposed consisting in the deposition of new dielectric films with chemical gradient. This thesis focuses on the development (deposition an etching processes) of new gradient compounds incorporated into SiO2 to address the current issues.
Integrated optical functions on microbolometer focal planes for uncooled infrared imaging
Thermal infrared imaging (wavelengths 8-14 µm) is a growing field, particularly in industry, transportation, and environment. It relies on a detection technology, microbolometers, for which CEA-Leti is at the forefront of the global state of the art. Integrating advanced optical functions directly onto the detectors is a very promising approach for improving performance, compactness, and cost in future infrared cameras.
The optical functions under consideration include spectral filtering, polarimetry, wavefront correction, and more. Some aim to enrich the image with information essential for applications such as absolute thermography (temperature and emissivity measurement), identification for automated scene interpretation (machine vision), gas detection, and others.
The proposed work will include the design, fabrication, and electro-optical characterization of functionalized microbolometer arrays. Using 3D electromagnetic simulation tools, the design of these optical functions will take into account the compatibility with our microbolometer technologies and the capabilities of our microfabrication facilities. Fabrication will take place in the CEA-Leti cleanrooms by dedicated personnel, but the candidate will participate in defining and monitoring the work. Finally, optical and electro-optical characterizations will be performed in our laboratory, if necessary with the development of dedicated characterization benches.
Acoustic and Ultrasound-based Predictive Maintenance Systems for Industrial Equipment
Power converters are essential in numerous applications such as industry, photovoltaic systems, electric vehicles, and data centers. Their conventional maintenance is often based on fixed schedules, leading to premature replacement of components and significant electronic waste.
This PhD project aims to develop a novel non-invasive and low-cost ultrasound-based monitoring approach to assess the state of health and remaining useful life (RUL) of power converters deployed across various industries.
The research will focus on identifying and characterizing ultrasonic signatures emitted by aging electronic components, and on developing physics-informed neural networks (PINNs) to model their degradation mechanisms. The project will combine experimental studies with advanced signal processing and AI techniques (compressed sensing), aiming to detect early signs of failure and enable predictive maintenance strategies executed locally (edge deployment).
The research will be carried out within a Marie Sklodowska-Curie Actions (MSCA) Doctoral Network, offering international training, interdisciplinary collaboration, and secondments at leading academic and industrial partners across Europe (Italy and Netherlands for this PhD offer).
Integrated material–process–device co-optimization for the design of high-performance RF transistors on advanced nanometer technologies
This PhD research focuses on the integrated co-optimization of materials, fabrication processes and device architectures to enable high-performance RF transistors on advanced nanometer-scale technologies. The work aims to understand and improve key RF figures of merit—such as transit frequency, maximum oscillation frequency, noise behaviour and linearity—by establishing clear links between material choices, process innovations and transistor design.
The project combines experimental development, structural and electrical characterization, and advanced TCAD simulations to analyse the strengths and limitations of different integration schemes, including FD-SOI and emerging 3D architectures such as GAA and CFET. Particular attention will be given to the engineering of optimized spacers, gate stacks, junction placement and epitaxial source/drain materials in order to minimize parasitic effects and enhance RF efficiency.
By comparing planar and 3D device platforms within a unified modelling and characterization framework, the thesis aims to provide technology guidelines for future generations of energy-efficient RF transistors targeting applications in 5G/6G communications, automotive radar and low-power IoT systems.
Instrumented PCB for predictive maintenance
The manufacturing of electronic equipment, and more specifically Printed Circuit Boards (PCBs), represents a significant share of the environmental impact of digital technologies, which must be minimized. Within a circular economy approach, the development of monitoring and diagnostic tools for assessing the health status of these boards could feed into the product’s digital passport and facilitate their reuse in a second life. In a preventive and prescriptive maintenance perspective, such tools could extend their lifespan by avoiding unnecessary periodic replacement in applications where reliability is a priority, as well as adapting their usage to prevent premature deterioration.
This PhD proposes to explore innovative instrumentation of PCBs using ‘virtual’ sensors, advanced estimators powered by measurement modalities (such as piezoelectric, ultrasonic, etc.) that could be integrated directly within the PCBs. The objective is to develop methods for monitoring the health status of the boards, both mechanically (fatigue, stresses, deformations) and electronically.
A first step will consist of conducting a state-of-the-art review and simulations to select the relevant sensors, define the quantities to be measured, and optimize their placement. Multi-physics modeling and model reduction will then make it possible to link the data to PCB integrity indicators characterizing its health status. The approach will combine numerical modeling, experimental validations, and multiparametric optimization methods.
Electron beam probing of integrated circuits
The security of numerical systems relies on cryptographic chains of trust starting from the hardware up to end-user applications. The root of chain of trust is called a “root of trust” and takes the form a dedicated Integrated Circuit (IC), which stores and manipulates secrets. Thanks to countermeasures, those secrets are kept safe from extraction and tampering from attackers.
Scanning Electron Microscope (SEM) probing is a well-known technique in failure analysis that allows extracting such sensitive information. Indeed, thanks to a phenomenon known as voltage contrast, SEM probing allows reading levels of transistors or metal lines. This technique was widely used in the 90s on ICs frontside, but progressively became impractical with the advance of manufacturing technologies, in particular the increasing number of metal layers. Recent research work (2023) showed that SEM-based probing was possible from the backside of the IC instead of frontside. The experiments were carried-out on a quite old manufacturing technology (135 µm). Therefore, it is now essential to characterize this threat on recent technologies, as it could compromise future root of trusts and the whole chains of trust build on top of them.
The first challenge of this PhD is to build a reliable sample preparation process allowing backside access to active regions while maintaining the device functional. The second challenge is to characterize the voltage contrast phenomenon and instrument the SEM for probing active areas. Once the technique will be mature, we will compare the effect of the manufacturing technology against those threats. The FD-SOI will be specifically analyzed for potential intrinsic benefits against SEM probing.