Enhanced Quantum-Radiofrequency Sensor

Through the Carnot SpectroRF exploratory project, CEA Leti is involved in radio-frequency sensor systems based on atomic optical spectroscopy. The idea behind the development is that these systems offer exceptional detection performance. These include high sensitivity´ (~nV.cm-1.Hz-0.5), very wide bandwidths (MHz- THz), wavelength-independent size (~cm) and no coupling with the environment. These advantages surpass the capabilities of conventional antenna-based receivers for RF signal detection.
The aim of this thesis is to investigate a hybrid approach to the reception of radio-frequency signals, combining atomic spectroscopy measurement based on Rydberg atoms with the design of a close environment based on metal and/or charged material for shaping and local amplification of the field, whether through the use of resonant or non-resonant structures, or focusing structures.
In this work, the main scientific question is to determine the opportunities and limits of this type of approach, by analytically formulating the field limits that can be imposed on Rydberg atoms, whether in absolute value, frequency or space, for a given structure. The analytical approach will be complemented by EM simulations to design and model the structure associated with the optical atomic spectroscopy bench. Final characterization will be based on measurements in a controlled electromagnetic environment (anechoic chamber).
The results obtained will enable a model-measurement comparison to be made. Analytical modelling and the resulting theoretical limits will give rise to publications on subjects that have not yet been investigated in the state of the art. The structures developed as part of this thesis may be the subject of patents directly exploitable by CEA.

3D ultrasound imaging using orthogonal row and column addressing of the matrix array for ultrasonic NDT

This thesis is part of the activities of the Digital Instrumentation Department (DIN) in Non-Destructive Testing (NDT), and aims to design a new, fast and advanced 3D ultrasound imaging method using matrix arrays. The aim will be to produce three-dimensional ultrasound images of the internal volume of a structure that may contain defects (e.g. cracks), as realistically as possible, with improved performance in terms of data acquisition and 3D image computation time. The proposed method will be based on an approach developed in medical imaging based on Row and Column Addressed (RCA) arrays. The first part will focus on the development of new data acquisition strategies for matrix arrays and associated ultrafast 3D imaging using RCA approach in order to deal with conventional NDT inspection configurations. In the second part, developed methods will be validated on simulated data and evaluated on experimental data acquired with a conventional matrix array of 16x16 elements operating in RCA mode. Finally, a real-time proof of concept will be demonstrated by implementing the new 3D imaging methods in a laboratory acquisition system.

Prediction of Soiling on PV modules/systems through Real-World Environment Modeling and Data Fusion

Photovoltaic (PV) systems, particularly those installed in regions prone to soiling such as arid areas, coastal sites, and agricultural zones, can experience energy losses of up to 20–30% annually. These losses translate to financial impacts exceeding €10 billion in 2023.
This thesis aims to develop a robust and comprehensive method to predict soiling accumulation on PV modules and systems by combining real-world environmental modeling with operational PV data (electrical, thermal, optical). The research will follow a bottom-up approach in three stages:

1. Component/Module Level: Reproduction and modeling of soiling accumulation in laboratory conditions, followed by experimental validation. This stage will leverage the CEA’s expertise in degradation modeling, including accelerated testing.

2. Module/System Level: Implementation of monitoring campaigns to collect meteorological, operational, and imaging data, combined with field soiling tests on a pilot site. The data will validate and enhance CEA diagnostic tools by introducing innovative features such as AI-driven soiling propagation prediction.

3. System/Operational Level: Validation of the proposed method on commercial PV modules in utility-scale PV plants, aiming to demonstrate scalability and real-world applicability.

The outcomes of this thesis will contribute to the development of an innovative tool/method for comprehensive soiling diagnostics and prognostics in PV installations, enabling the minimization of energy losses while anticipating and optimizing cleaning strategies for PV plants.

Superconducting Devices in Silicon

The project focuses on the study of superconducting devices with silicon as a semiconductor. Those include standard silicon transistors with superconducting source and drain contacts and superconducting resonators. The common properties is the superconducting material which is elaborated with the constrain of being compatible with the silicon CMOS technology.
In the actual situation of the project, devices with CoSi2, PtSi and Si:B superconducting contacts have been fabricated using the 300 mm clean room facility at the LETI and in collaboration with our partners at Uppsala university and C2N Paris Saclay. The main issue is now to characterize the electronic transport properties at very low temperature.

Multi-physical characterization of potassium hybrid supercapacitors for performance improvement

The PhD subject focuses on the optimization of potassium hybrid supercapacitors (KIC), which combine the properties of supercapacitors (power, cyclability) and batteries (energy). This system, developed at the CEA, represents a promising technology, low cost and without critical/strategic materials. However, performance optimization still requires overcoming various obstacles observed in previous work, in particular on the intercalation of potassium in graphite and the heating phenomena of cells during operation. In order to explore in depth the operating mechanisms of the KIC system, an essential part of the thesis project will include experiments conducted at the ESRF (European Synchrotron Radiation Facility), where advanced diffraction and imaging techniques will be used to analyze the structure of the materials and their behavior in real operating conditions. The processing of the data collected will also be crucial in order to establish correlations between the physicochemical properties of the materials and the overall performance of the system. This thesis will contribute to the fundamental understanding of the multi-physical mechanisms at stake in KIC to develop innovative design strategies and thus improve their capacity, energy efficiency and lifetime.

Embedded systems for natural acoustic signals analysis while preserving privacy

The PhD topic aims at developping Embedded systems to record and analyze natural acoustic signals. When targeting city deployement, the privacy issue is raised: how can we keep a satisfactory analysis level while never record or transmit human voices?

Learning Interpretable Models for Stress Corrosion of Stainless Steels Exposed in the Primary Environment of PWRs

Stress corrosion cracking (SCC) of austenitic alloys in water-cooled nuclear reactors is one of the most significant component degradation phenomena. SCC occurs due to the synergistic effects of tensile stresses, environment and material susceptibility. For reactor life extension, understanding this mechanism is essential. The methodology most frequently employed to investigate SCC cracking is an experimental one, requiring lengthy and costly tests of several thousand hours. Furthermore, the considerable number of critical parameters that influence susceptibility to SCC cracking and coupling effects have resulted in test grids increasing in length and complexity. This thesis proposes a novel approach based on the use of interpretable models that are driven by the artificial intelligence of fuzzy logic. The aim is to reduce the length and cost of research activities by focusing on relevant tests and parameters that can improve environmental performance. The key issues here will be to add the performance of artificial intelligence to the experimental approach, with the aim of defining susceptibility domains for the initiation of SCC cracks as a function of the critical parameters identified in the model, and providing data for the development of new materials by additive manufacturing. The thesis will develop a numerical model that can be used as guidance in decision-making regarding the stress corrosion mechanism. The future PhD student will also carry out experimental work to validate this new numerical approach.

Direct metal etch mechanisms study for the BEOL of ultimate SOI nodes

The topic fits into the deployment of silicon technologies at the European level (European chips act), led by CEA-Leti. The focus will be on providing advanced technological building blocks for electrical routing (Back End of Line) of logic and analog devices. The development of increasingly high-performance circuits requires interconnections with more aggressive dimensions. The use of traditional routing materials such as copper is therefore being questioned, as is the conventional back-end of line (BEOL) architecture. This thesis topic will address a breakthrough approach, necessary to achieve these ultimate dimensions.
The objective of this PhD is to develop a BEOL technological building block for the advanced SOI (Silicon on Insulator) nodes through a direct metal etching approach. After a preliminary simulation of the electrical properties of interconnections made with different metals, the work will consist in proposing and implementing an innovative integration. In the first phase, the task will be to determine the design of the electrical test structures and establish an integration scheme. In the second phase, the research work will focus on studying the direct etching of the selected metal using sustainable processes while maintaining the performance of both the processes and the final device. The candidate will be able to rely on the eco-innovation team to perform a comparative life cycle analysis (LCA) of this building block.
The PhD contract is for a duration of 3 years and the research work will take place in the clean rooms of CEA-Leti. To successfully carry out this study, the candidate will have access to state-of-the-art equipment and a cutting-edge work environment.

SCO&FE ALD materials for FeFET transistors

Ferroelectric Field Effect Transistors FeFET is a valuable high-density memory component suitable for 3D DRAM. FeFET concept combines oxide semiconductors SCO as canal material and ferroelectric metal oxides FE as transistor gate [2, 3]. Atomic layer deposition ALD of SCO and FE materials at ultrathin thickness level (<10 nm) and low temperature (10 cm2.Vs); ultrathin (<5nm) and ultra-conformal (aspect ratio 1:10). The PhD student will beneficiate from the rich technical environment of the 300/200mm CEA-LETI clean-room and the nano-characterization platform (physico-chemical, structural and microscopy analysis, electrical measurements).
The developments will focus on the following items:
1-Comparison of SCO layers (IGZO Indium Gallium Zinc Oxide) fabricated using ALD and PVD techniques: implementation of adapted mesurements techniques and test vehicles
2-Intrinsec and electrical characterization of ALD-SCO (IWO, IGZO, InO) and ALD-EF (HZO) layers: stoichiometry, structure, resistivity, mobility….
3-Co-integration of ALD-SCO and ALD-FE layers for vertical and horizontal 3D FeFET structures

[1]10.35848/1347-4065/ac3d0e
[2]https://doi.org/10.1109/TED.2023.3242633
[3]https://doi.org/10.1021/acs.chemmater.3c02223

Laser Fault Injection Physical Modelling in FD-SOI technologies: toward security at standard cells level on FD-SOI 10 nm node

The cybersecurity of our infrastructures is at the very heart in the digital transition on-going, and security must be ensured throughout the entire chain. At the root of trust lies the hardware, integrated circuits providing essential functions for the integrity, confidentiality and availability of processed information.
But hardware is vulnerable to physical attacks, and defence has to be organised. Among these attacks, some are more tightly coupled to the physical characteristics of the silicon technologies. An attack using a pulsed laser in the near infrared is one of them and is the most powerful in terms of accuracy and repeatability. Components must therefore be protected against this threat.
As the FD-SOI is now widely deployed in embedded systems (health, automotive, connectivity, banking, smart industry, identity, etc.) where security is required. FD-SOI technologies have promising security properties as being studied as less sensitive to a laser fault attack. But while the effect of a laser fault attack in traditional bulk technologies is well handled, deeper studies on the sensitivity of FD-SOI technologies has to be done in order to reach a comprehensive model. Indeed, the path to security in hardware comes with the modelling of the vulnerabilities, at the transistor level and extend it up to the standard cells level (inverter, NAND, NOR, Flip-Flop) and SRAM. First a TCAD simulation will be used for a deeper investigation on the effect of a laser pulse on a FD-SOI transistor. A compact model of an FD-SOI transistor under laser pulse will be deduced from this physical modelling phase. This compact model will then be injected into various standard cell designs, for two different objectives: a/ to bring the modelling of the effect of a laser shot to the level of standard cell design (where the analog behaviour of a photocurrent becomes digital) b/ to propose standard cell designs in FD-SOI 10nm technology, intrinsically secure against laser pulse injection. Experimental data (existing and generated by the PhD student) will be used to validate the models at different stages (transistor, standard cells and more complex circuits on ASIC).
Ce sujet de thèse est interdisciplinaire, entre conception microélectronique, simulation TCAD et simulation SPICE, tests de sécurité des systèmes embarqués. Le candidat sera en contact/encadré avec deux équipes de recherche; conception microélectronique , simulation TCAD et sécurité des systèmes embarqués.

Contacts: romain.wacquez@cea.fr, jean-frederic.christmann@cea.fr, sebastien.martinie@cea.fr

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