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Thesis
Home   /   Thesis   /   Characterization of 3D technologies at mmw: monolithic and with direct hybrid bonding

Characterization of 3D technologies at mmw: monolithic and with direct hybrid bonding

Abstract

3D technologies (in monolithic or hybrid integration) present an industrial appeal for More Moore and More than Moore applications. Thanks to the channel materials and compact integration, high RF figures of merit go up to 300GHz are possible.

The objective of the thesis is to analyze the process of current 3D monolithic (3DSI) and to benchmark it to Hybrid 3D solutions with Direct Hybrid Bonding (DHB). Both technologies developed at Leti.

In order to optimize 3DSI, low thermal budget transistors must be improved.

The PhD candidate will define the best trade-off in RF and propose and optimize the ideal technology to address the frequency range of 100-300GHz.

Laboratory

Département Composants Silicium (LETI)
Service des Composants pour le Calcul et la Connectivité
Laboratoire Dispositifs Quantiques et Connectivité
Université Grenoble Alpes
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