In order to take advantage of Wide band gap components (GaN and SiC), it has been demonstrated that it is necessary to reduce the parasitic elements in the switching cells and therefore in the power modules. The 'trivial' solution is to make the power modules more compact to solve this problem of parasitic elements. However, this is often done at the expense of thermal performance. The subject proposed here has therefore the ambition to not neglect any of these aspects by taking advantage of the new freedoms offered by ceramic 3D printing in terms of design and performance.
Also, this thesis will start with a study of current wide band gap power modules, which will allow the PhD student to complete his knowledge and to understand the limits of these architectures: parasitic elements, parallelizations, signal integrity, thermal management, partial discharges ...
From this first assessment, which is intended to be as exhaustive as possible, we propose to use 3D FEM simulation to find a set of topologies that can be produced by 3D ceramic printing and that will be able to respond to the problems identified.
Based on these results, a new high voltage power module (800V-400A) can then be designed and built.
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