As electronic architectures become increasingly complex and dense, managing thermal dissipation is a critical challenge to ensure system reliability and performance. In constrained environments and demanding applications, localized hotspots require innovative cooling solutions compatible with advanced packaging integrations such as 2.5D and 3D. This PhD project is part of this dynamic and aims to explore wafer-level thermal management approaches, relying in particular on advanced 3D integration processes such as direct bonding.

The PhD candidate will contribute to the design and fabrication of test vehicles incorporating temperature sensors and active thermal structures. The main objective will be to assess the efficiency of novel cooling architectures, with a particular focus on integrating microfluidic channels within the stacks, combined with the use of high thermal conductivity materials. The work will include aspects of thermal (and possibly thermo-mechanical) modeling, cleanroom process development, and experimental characterization.

This research topic, at the crossroads of microelectronics and thermal management, offers a stimulating and interdisciplinary framework, closely aligned with emerging industrial needs in advanced packaging.