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Thesis
Home   /   Post Doctorat   /   Thermal properties of 3D aluminum nitride structures for electronic packaging

Thermal properties of 3D aluminum nitride structures for electronic packaging

Additive manufacturing, new routes for saving materials Engineering sciences Materials and applications Technological challenges

Abstract

The 12-month postdoctoral fellowship is part of the overall 3DNAMIC project, funded by the Occitanie region and involving the Materials platform of the DRTDOCC department and the Laplace laboratory. A thesis began in December 2024 aimed at “the study and characterization of 3D aluminum nitride ceramics for the thermal packaging and management of electronic components.”
The postdoc is scheduled to begin at approximately in September 2026, with the following main objectives:

Objective 1: Perform a comparative analysis of the thermal properties of ceramics produced by AF elements and on model structures using different materials available in the CEA materials platform.
Objective 3: Propose, qualify, and validate, numerically and then experimentally, heat dissipation structures for ceramics obtained by FA as part of the 3DNAMIC project.

Laboratory

Département Occitanie (CTREG)
DOCC
DOCC
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