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Thesis
Home   /   Thesis   /   Design and implementation of cryogenic electronics for signal acquisition at cryogenic temperatures

Design and implementation of cryogenic electronics for signal acquisition at cryogenic temperatures

Condensed matter physics, chemistry & nanosciences Engineering sciences Instrumentation Mesoscopic physics

Abstract

The aim of our proposed thesis is to demonstrate that it is possible to integrate at cryogenic temperatures the entire instrumentation chain for reading and controlling quantum components at cryogenic temperatures
qubits. In other words, we are seeking to place in-situ, in the cryostat and as close as possible to the quantum components
(qubits), all the systems that are currently located outside. In addition, to achieve a major breakthrough
we are aiming for a fully programmable microwave chain (> 2 GHz). This is the subject of an ongoing thesis
financed by the Agence Innovation Défense (AID) and the Commissariat à l'Énergie Atomique (CEA) and a RAPID-type project application.
RAPID type project.

As part of this thesis, we will start at a few hundred MHz. Several main problems
are identified and need to be solved, including
- design and integration of chiplets in System-in-Packages (SiPs) compatible with cryogenic temperatures ;
- interfacing and integrating the Analog to Digital Converter (ADC), Digital to Analog
Converter (DAC) and processing components;
- manage high data rates (several tens of Gbit/s per qubit);
- maximum roundtrip latency of 200 ns;
- energy management (a few tens of mW budget per qubit);
- choice of cryogenic stages adapted to the different processing stages;
- choice of independent technologies

Laboratory

Institut rayonnement et matière de Saclay
Service de Physique de l’Etat Condensé
Plateforme de Support à la Recherche
Paris-Saclay
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