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Thesis
Home   /   Post Doctorat   /   Ge-on-Insulator (GeOI) substrates for photonics

Ge-on-Insulator (GeOI) substrates for photonics

Electronics and microelectronics - Optoelectronics Engineering sciences Materials and applications

Abstract

The induction of tensile strain in intrinsic and doped Germanium (Ge) is one approach currently explored to transform the Ge indirect bandgap into a direct one. To take full advantage of Ge, we study the Ge CMOS photonics platform with Ge-on-Insulator (GeOI) structure, which enables strong 2D optical confinement in the Ge photonic-wire devices. One recent study in our lab showed the interest of a method of incorporation of mechanical stress into Ge, one of the essential ingredients of the laser. In particular, the method could be applied to the massive Ge, making compatible gap direct and crystalline quality.
Post-doc objectives : Development of GeOI substrates from massive Ge donors with tensile strain inside the Ge film. These developments will be realized from the existing Smart Cut / thinning processes, combined with technological steps to overcome their current limits (SAB bonding). The substrates obtained will be characterized to determine their state of deformation as well as their damage (Raman / XRD) and final GeOI substrates will be provided to the application laboratories for the production of photonic components.

Laboratory

Département Composants Silicium (LETI)
Service Intégrations et Technologies pour les conversions d'énergies
Laboratoire Intégration et Transfert de Film
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