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Thesis
Home   /   Post Doctorat   /   Analysis of Gas Effluents for More Eco-Responsible Plasma Etching Processes

Analysis of Gas Effluents for More Eco-Responsible Plasma Etching Processes

Electronics and microelectronics - Optoelectronics Emerging materials and processes for nanotechnologies and microelectronics Engineering sciences Technological challenges

Abstract

Traditionally used fluorinated gases, such as CF4 and C4F8, exhibit extremely high Global Warming Potentials (GWPs), significantly contributing to climate change. To address these environmental challenges, the project aims to promote the use of alternative low-GWP gases in combination with efficient exhaust abatement systems at the reactor outlet, while maintaining high-performance plasma etching processes. In this context, the postdoctoral researcher will be responsible for the analysis and characterization of gaseous species in an industrial plasma etching reactor using mass spectrometry. These measurements will be compared with the gas effluent at the outlet of the pumping and abatement systems. The main objectives are (i) to quantify the Destruction Removal Efficiency (DRE) of high and low GWP fluorocarbon gases during plasma processing and within the pumping and abatement stages, and (ii) to identify and propose innovative, environmentally responsible alternatives to minimize the release of high-GWP gaseous effluents.

Laboratory

Département des Plateformes Technologiques (LETI)
Service des procédés de Patterning
Laboratoire Gravure
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