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Thesis
Home   /   Thesis   /   Advanced SOI technologies: Design, Integration & Electrical characterization

Advanced SOI technologies: Design, Integration & Electrical characterization

Emerging materials and processes for nanotechnologies and microelectronics New computing paradigms, circuits and technologies, incl. quantum Technological challenges

Abstract

Join CEA-Leti to develop a technological module (localized ground plane) for various applications (EU FDSOI, RF devices, ultra-miniaturized pixels, cryo-RF and quantum).
This PhD topic is challenging since you will design step by step a specific module and test it electrically. Our team will support you technically and scientifically to conduct this work. Some data are already available and waiting for your analysis.
During this PhD, you will have the opportunity to learn how a module/device is designed step by steps:
From the idea (simulation, bibliography)
Material & Processes understanding (bonding, CMP)
Integration & cleanroom fabrication management
Characterization (physical & electrical: mobility, interface traps)
Valorization (presentations, article)

Laboratory

Département Composants Silicium (LETI)
Service des Composants pour le Calcul et la Connectivité
Laboratoire des Transistors Avancés
Université Grenoble Alpes
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