Direct dies-to-wafer bonding has become, in recent years, a major development axis in microelectronics and at the heart of many LETI projects, both in silicon photonics and for 3D applications involving hybrid bonding.

Due to their small size, die bonding allows the study of direct bonding edge effects and the implementation of new direct bonding processes that can shed original light on the mechanisms of direct bonding, which are already well studied at LETI. From a more technological perspective, the development of thin stackable chips will also be a very interesting technological key for many applications. This approach is a clever alternative to classical damascene processes to address the challenges related to the planarization of surfaces with low density of high topographies.